| 摘要 |
PROBLEM TO BE SOLVED: To provide a board-fixing device capable of wire bonding of especially high quality, irrespective of warpage of a board, and the fixing structure of a board. SOLUTION: In a wire-bonding device, a board 15 on which a bare chip 10 is mounted is fixed, and the terminals of the bare chip 10 are connected with a pattern formed on the board 15 through wires. The wire-bonding device is constituted of a suction chucking stage 20 where suction holes 23 are formed and the board 15 is sucked and fixed on the upper surface, a suction tube 26 which is positioned below the board 15, has the suction holes 23, and is arranged so as to penetrate the suction stage 20 and is movable in the vertical direction, a suction means for sucking the board 15 through both of the suction holes 23, and a vertically moving means which moves the suction tube 26 between the board 15 and the suction stage 20. The suction tube 26 is lifted up to the lower surface of the board 15 by using a vertical moving means, and made to descend in the state directly sucking the board 15. As a result, the board 15 is sucked and fixed on the upper surface of the suction stage 20. |
