| 摘要 |
PURPOSE: An apparatus of shielding particles in a sputtering device is provided to minimize particles deteriorating the quality and characteristic of a metal layer evaporated on a wafer when metal ions are sputtered. CONSTITUTION: An apparatus of shielding particles in a sputtering device comprises: a direct current bias(121) forming a direct current bias assembly(10); a fixed screw(122) established in the center of the direct current bias(121) while the screw is assembled together with a clamp ring(100) to move when the clamp ring moves up and down;, a ceramic(123) surrounding and insulating the axis part of the fixed screw(122); and a snap ring(124) for preventing the ceramic from dropping out of the direct current bias. A wave spring is elastically inserted between the ceramic and the snap ring to remove the gap between the ceramic and the snap ring. And a bottom flange part(121a) of the direct current bias is formed in the shield(90) by having the direct current bias assembly(10) inserted through an establishing hole(91) formed in the shield.
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