STACK PACKAGE

摘要

PURPOSE: A stacked package is to increase its capacity by containing two semiconductor chips within one package and to reduce its area by attaching the semiconductor chips longitudinally. CONSTITUTION: A stacked package comprises a substrate(10) having a rectangular plate and a rectangular column integrally disposed on the substrate to be perpendicular to the substrate. A semiconductor chip(20) is mounted to each of both sides of the rectangular column. A heat sink(50) is mounted onto the rectangular plate near to outside of the semiconductor chip. The rectangular column extends from a center of one side edge to a center of opposite side edge. The semiconductor chip includes many bonding pads at its both side edges. The first pattern film is attached to each of both side edges and its adjacent side at top surface of the semiconductor chip having the bonding pad. The first pattern film has a circuit pattern on a polyimide-based film. A contact pad is provided to one side of a bottom surface of the first pattern film whereas an electrode pad(26) is provided to another side thereof.