| 摘要 |
PURPOSE: An apparatus for controlling a bond head of a wire bonder is provided to prevent damage to a device by minimizing an impact on the device by a capillary. CONSTITUTION: An apparatus for controlling a bond head of a wire bonder comprises: a central control unit(10) for generating signals associated with an elevating speed of a capillary and comparing /analyzing feedback information; a servo control unit(20) for receiving a signal from the central control unit and converting information only associated with the high and low speed terms out of the overall terms the capillary moves, to an analog signal; an amplifying unit(30) for receiving the analog signal from the servo control unit, amplifying the received signal and outputting the amplified signal to a servo motor; the servo motor(40) is driven when the information associated with a high speed term is inputted from the servo control unit and stops being driven when the information associated with a low speed term is inputted; an encoder unit(50) connected to the servo motor for generating a counter signal at predetermined time units whenever the servo motor rotates; and a contact signal detection unit(60) for receiving the counter signal generated from the encoder unit, feeding back the received counter signal and detecting a contact signal between the capillary and a device by measuring the increment of the counter signal. |
