| 摘要 |
PURPOSE: An HSG forming apparatus makes it possible to stack product wafers in all slots of process zone, and prevents the surface of the wafer from oxidizing. CONSTITUTION: Whenever at least a wafer is carried into an Input/Output(I/O) port, a controller for wafer transforming starts a wafer transformer to stack wafers inside the I/O port in a boat of a load lock chamber. Thus, the time from waiting of wafers inside I/O port is minimized. Also, a filter bonded to the I/O port controls the density of oxygen carried into the I/O port so that the oxidization of wafer surfaces is prevented.
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