发明名称 |
FILM FORMING METHOD AND DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method and film forming device in which utility factor of an organic metal containing liquid is high and also the organic metal containing liquid can accurately be coated on a processed body. SOLUTION: This film forming device comprises supplying means 28 for supplying an organic metal containing liquid of which a staple component is an organic metal separating out a file forming material by a pyrolysis reaction, coating means 126 for coating the organic metal containing liquid supplied from the supplying means on a processed body W, and heating means 52 for heating the processed body on which the organic metal containing liquid is coated at a predetermined temperature by the coating means 126. The coating means 126 comprises a coating liquid containing body 100 which can contain the organic metal containing liquid and can also contact with or separate from the processed body.
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申请公布号 |
JP2000138185(A) |
申请公布日期 |
2000.05.16 |
申请号 |
JP19980308661 |
申请日期 |
1998.10.29 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
WADA YUICHI;SHODA HIROYUKI;AIDA HISASHI;YOSHIDA NAOMI |
分类号 |
H01L21/3205;B05C1/02;B05C11/08;B05C11/10;B05D1/28;B05D1/32;C23C18/02;C23C18/08;H01L21/00;H01L21/288;H01L23/52;(IPC1-7):H01L21/288;H01L21/31;H01L21/320 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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