| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a conversion module, which can bond socket pins to a conversion board simply and securely at accurate positions on the board, therefore can obtain products superior in connection reliability. SOLUTION: This manufacturing method, wherein conductive fusible bodies 48 are respectively kept formed previously on each of the surfaces of conductor parts 14 for connection provided on the side of the upper surface of a conversion board and under at least either of the lower end surfaces of socket pins 24 and 24A. By performing temporary fixing of the fusible bodies 48, the fusible bodies 48 are brought into contact with the lower end surfaces of the pins 24 and 24A and the surfaces of the conductor parts 14. In this state, through thermal fusion of the fusible bodies 48, the pins 24 and 24A are subjected to surface-mounting on the conductor parts 14. As a result, a desired conversion module 1 is manufactured.
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