| 摘要 |
<p>1,086,003. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. March 15, 1965 [March 13, 1964], No. 10737/64. Heading H1K. An insert for location between the conductive casing of an electronic device such as semiconductor rectifier 1 with conducting base 3, and a metal support 6 comprises fragments of electrically insulating, thermally conductive material such as beryllia or aluminia, embedded in resilient electrically insulating material 7 such as silicone or synthetic rubber or epoxy resin, to provide a plurality of heat-conducting paths. The insert may comprise an upstanding resin portion 9 which may be integral or separate, to increase the leakage path or alternatively, the support 6 may be provided with a groove at the periphery of the insert. The fragments may be of circular or hexagonal crosssection arranged in concentric rings and each heat-conducting path may be constituted by a plurality of fragments in contact throughout the depth. The opposite contacting surface of the insert may be coated with a deformable metal and as aluminium, tin or zinc.</p> |
