发明名称 CHEMICAL MECHANICAL POLISHING DEVICE
摘要 PURPOSE: A chemical mechanical polishing device is provided to prevent the scratch of the surface of film and to obtain uniform slurry by arranging the vibrator and the ultra sonic generator inside the polishing unit and at the lower part of the slurry drum. CONSTITUTION: A device comprises a slurry drum(20), an ultra sonic generator(21a, 23a), an ultra sonic vibrator(21b, 23b), a slurry controlling unit(22), a polishing table(24), a moving tube(25), and a buffing table(26). The polishing unit(30) includes the slurry controlling unit(22) which selectively receives or blocks the slurry when there is slurry providing signal, the polishing table(24) in which the polishing is carried out by the provided slurry and the buffing table(26). The slurry control part includes the pump and the valve. The ultra sonic generator(23a) and the ultra sonic vibrator(23b) is located between the polishing table and the slurry controlling unit.
申请公布号 KR20000027513(A) 申请公布日期 2000.05.15
申请号 KR19980045458 申请日期 1998.10.28
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 LEE, NAM GUK;JEON, CHAN WOON
分类号 H01L21/302;(IPC1-7):H01L21/302 主分类号 H01L21/302
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