发明名称 ELECTRONIC PART SHIELDING COVER
摘要 PROBLEM TO BE SOLVED: To provide an electronic part shielding cover which is high in both electromagnetic shielding effect and heat dissipating effect and low in cost. SOLUTION: A housing part 1b where an electronic part 2 is housed is provided inside the case 1a of an electronic part shielding cover 1 formed by press- molding a metal plate, an electromagnetic wave absorbing layer 3 is formed on both the front and rear of the case 1a, and circular through-holes 4 are bored in the upside of the case 1a to serve as vent holes. The electromagnetic wave absorbing layer is formed of a coating layer of electromagnetic wave loss material. Therefore, electromagnetic waves are blocked by the metal case 1a and absorbed by the electromagnetic wave absorbing layer 3, so that electromagnetic waves generated by an electronic part 2 and arriving electromagnetic waves from outside can be surely blocked. The through-holes 4 function as heat dissipating holes, so that heat released from the electronic part 2 can be surely exhausted. At this point, the diameter of the through-hole 4 is set 1/4 or below as small as the wavelengthλof electromagnetic waves to block, and electromagnetic waves can be prevented from passing through the through- holes 4.
申请公布号 JP2000133985(A) 申请公布日期 2000.05.12
申请号 JP19980304140 申请日期 1998.10.26
申请人 KITAGAWA IND CO LTD 发明人 KITAGAWA KOJI
分类号 H05K9/00;H01L23/02;H01L23/06;(IPC1-7):H05K9/00 主分类号 H05K9/00
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