发明名称 CONDUCTIVE COMPOSITION FOR IMPROVING CONTACT RESISTANCE
摘要 PROBLEM TO BE SOLVED: To reduce the connection resistance with aluminum, chromium or stainless steel by including a specific quantity of a conductive filler comprising silver powder and nickel powder in a composition and by setting the average particle diameter of the silver powder larger than that of the nickel powder. SOLUTION: A conductive filler containing silver powder and nickel powder is used and the percentage content of the conductive filler is preferably set to 50-90 wt.%. Any of a scale-like (flake-like), particle-like, thin piece-like, dendritic or irregular shape is used as the form of a conductive composition. In this case, in order to reduce the resistance (volume resistivity) of the conductive composition itself and to improve the applicability thereof, the combination of the scale-like and particle-like forms is advantageously used. In particular, the scale-like form is preferably used for the silver powder, and the nickel powder is formed into a particle-like form having the average particle diameter smaller than that of the silver powder. For instance, the center value of the average particle diameter of the silver powder is set to 20μm or less and the center value of the average particle diameter of the nickel powder is set to 5μm or less.
申请公布号 JP2000133043(A) 申请公布日期 2000.05.12
申请号 JP19980300658 申请日期 1998.10.22
申请人 THREE BOND CO LTD 发明人 NAKAYA MANABU
分类号 H01B1/00;C08K3/08;C08L101/00;C09J9/02;H01B1/22;(IPC1-7):H01B1/00 主分类号 H01B1/00
代理机构 代理人
主权项
地址