| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder jet from passing through a through hole and from jumping to the part loading face side of a printed board, by giving the solder jet to the lower face of the printed board in a state where a hole blocking means temporarily blocks the through hole, soldering the lower face of the printed board and removing the hole blocking means. SOLUTION: A solder jet is given to the lower face of a printed board 11 in a state where a hole blocking means 19 formed of a reveling board 21 temporarily blocks a through hole 14 and the lower face of the printed board 11 is soldered. When solder is thus executed, the solder jet is prevented from passing through the through hole 14 and from jumping to the part loading face-side of the printed board 11 with the leveling board 21. Thus, solder is prevented from sticking to electronic parts on the part loading face-side of the printed board 11. Even if the blocking means 19 is used, a part 20a in the half way of the outline cutting line 20 of the leveling board 21 is depressed, respective connection parts 22 are bent and the leveling board 21 can easily be removed. Thus, a trouble does not occur.
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