发明名称 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE MATERIAL, AND MANUFACTURE OF RELIEF PATTERN AND POLYIMIDE PATTERN
摘要 <p>PROBLEM TO BE SOLVED: To provide a photosensitive composition superior in photosensitive characteristics and storage stability and high in resolution and good in process stability by incorporating a specified triaryl-feldazyl compound and a specified titanocene compound and an additionally polymerizable compound. SOLUTION: The photosensitive composition comprises the 1, 3, 5-triaryl- feldazyl compound represented by formula I and the titanocene compound represented by formula II, and the additionally polymerizable compound, and in formulae I and II, R is a halogen atom or a univalent organic group; each of (m), (n), and (p) is, independently, an integer of 0-5; and each of R1-R10 is, independently, an H or halogen atom or a 1-20C alkoxy or heterocyclic group. In formula I, R is an H or halogen atom, such as Cl, F, or Br, or the like, and a heterocyclic group among the substituent represented by R1-R10 is embodied by thienyl and furyl groups and the like.</p>
申请公布号 JP2000131834(A) 申请公布日期 2000.05.12
申请号 JP19980303826 申请日期 1998.10.26
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 SASAKI HAN;KO MASAHIKO
分类号 H01L21/027;C08F283/04;C08K5/3477;C08K5/56;C08L79/08;C09D5/00;C09D7/12;C09D179/08;G03F7/004;G03F7/027 主分类号 H01L21/027
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