| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of removing a solder ball, which can remove easily the solder ball remaining on an uncleaned package, and a solder ball removal tool. SOLUTION: A solder ball removal tool 3a is constituted by such a structure that the other ends 15 of one pair of striped members 11 and 12 having an elasticity are secured on each other in a state that pinching parts 13 and 14 formed on one end of the respective members 11 and 12 of the members 11 and 12 are widely opened in such a way that the pinching parts 13 and 14 can be elastically opened and closed, heating units 16 and 17 are respectively provided in the vicinities of the parts 13 and 14 and a heating current is fed from a power supply 20 to the heating units 16 and 17. At this time of the removal of a solder ball, a current is made to flow through the heating units 16 and 17 of the tool 30 to heat the units 16 and 17 at the melting temperature of flux residues the pinching parts 13 and 14 are brought into contact with the flux residues on the upper part of the solder ball to pinch the solder ball between them while the flux residues are made to melt and the residues are removed. The molten flux residues are naturally cooled and are solidified.
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