| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a QFN(quad flat nonleaded) semiconductor package can be manufactured, in such a way that solder hardly adheres to the insulating portion between adjacent terminals for mounting. SOLUTION: In a method for manufacturing a QFN semiconductor package, the QFN semiconductor package is manufactured in such a way that plural package elements 10 each of which is provided with semicylindrical terminals 14 for mounting formed on its end faces in recessed states are laminated upon one another and adhered to each other by soldering. At sticking of the elements 10 to each other, protective layer unformed sections 19 which are surrounded by a protective layer 18 and on the bottoms of which conductors 16 are exposed are provided near the terminals 14 on the surface of a substrate 12, and after the plural package elements 10 carrying solder 20 supplied to the protective layer unformed sections 19 are laminated upon another, the elements 10 are adhered to each other via the solder 20 supplied to the layers 19 by melting the solder 20.
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