CHIP SIZE PACKAGE AND METHOD FOR RESIN-SEALING IT

摘要

PROBLEM TO BE SOLVED: To provide a structure of a chip size package in which a given hole is provided on an electronic circuit board, and a method for resin-sealing by which a resin is applied through the hole. SOLUTION: In this method for resin-sealing, a chip size package in which the electrode of an IC chip 1 is connected with an electrode of an electronic circuit board 2 having a square or round hole with the predetermined dimension 7 via a microbump is used. The chip size package is placed on a horizontal plane so as to make the electronic circuit board 2 upward, and a thermosetting resin 3 is applied to the surface of the IC chip through the hole of the electronic circuit board 2. As a result, the gap between the IC chip and the electronic circuit board and the surface of the IC chip can be sealed with resin by one applying operation.