| 摘要 |
PROBLEM TO BE SOLVED: To provide the semiconductor element which can obtain the more effective reliability at the same filler containing rate. SOLUTION: The semiconductor element which is sealed with the liquid-state resin comprising liquid-state thermosetting resin and filler has the relationship of 0.90<=W1/W<=1, 1.02<=W2/W<=1.15 when the average filler containing rate in the vicinity of the surface of a sealing part after the hardening of the liquid- state resin is made to be W1, the average filler containing rate in the vicinity of the bottom part of the sealing part is made to be W2 and the filler containing rate of the entire sealing part is made to be W.
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