发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To readily establish electrical connection by coating with a step reducing member a side of a conductive member which has a step between the top face and the insulating bottom surface arround the top face, and coating with a conductive film connected to the conductive member a side of the step reducing member, the top face of the conductive member, and the inner surface of a contact hole. SOLUTION: The top surface of an interlayer insulating film 10 that is exposed from the bottom of a contact hole 41 is higher than the top surface of an interlayer insulating film 40, that is exposed from the center of the bottom and projects from the bottom. A step at the bottom is reduced by a step- reducing member 50b. Hence, a Ti film 51 and a TiN film 52 that cover the top surface of the interlayer insulating film 40 have more uniform thickness, so as to establish good electrical connection between a conductive member 23 and a wire 54. A conductive member 23, a sidewall film 50a, and the step reducing member 50b are all made of amorphous silicon and are doped with phosphorus. Thus, contact resistances between these members are small, the effective contact areas is increased, thereby reducing the contact resistances.
申请公布号 JP2000133785(A) 申请公布日期 2000.05.12
申请号 JP19980305961 申请日期 1998.10.27
申请人 FUJITSU LTD 发明人 MITANI JUNICHI
分类号 H01L27/108;H01L21/8242 主分类号 H01L27/108
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