PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION AND METAL FOIL-POLYIMIDE COMPOSITE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor composition in the polyimide composite material comprising the polyimide and a metal material by incorporating the composition of a specified polymer and a photopolymerization initiator and and controling an average linear expansion ecoefficient after curing in a specified temperature range in a specified range. SOLUTION: The photosensitive composition comprises the polymer represented by the formula and the polymerization initiator and the average linear expansion coefficient is 10×10-6-30×10-6/ deg.C after curing in the range of 30-100 deg.C. In the formula, R1 is a tetravalent aromatic acid group; R2 is an aromatic diamine group containing >=60% diaminobenzanilide group; R3 is one of -OR4 and -NHR4 and -O-N+R4R5R6R7 group or a mixture of them and -OH group; R4 is a group having at least one ethylenically unsaturated bond; each of R5-R7 is an H atom or a 1-10C hydrocarbon group; and (n) is 1 or 2.