| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for manufacturing a noncontacting type IC card, by which the mounting of an IC chip to an antenna substrate and the joining process of the antenna substrate with a base material are executed through the use of a low-temp. joining process without requiring a lot of manhour and equipment, and a noncontact type IC card. SOLUTION: The method includes a vamp buring process for buring a vamp 6 by using a high molecular resin and also exposing the vamp 6 by grinding the high molecular resin and an IC chip mounting process for joining the exposure part of the vamp 6 with an electrode terminal 4 by using a conductive adhesive and joining a part except the exposure part of the vamp 6 on a high molecular resin surface where the vamp 6 is buried with the antenna substrate 5 through the use of the high molecular adhesive. The antenna substrate 5 where the IC chip 7 is mounted is joined with at least one second base material while adhered by pressing through the use of a thermoplastic adhesive 9 and also heating and hardening of the conductive adhesive, the high molecular adhesive and the thermoplastic adhesive 9 are simultaneously executed. |
