| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface mount oscillator where the manufacture time can be reduced by progressing adhesion of a crystal chip and an IC chip to a package in parallel. SOLUTION: In the surface mount crystal oscillator consisting of a crystal chip 4 and an IC chip 5 that are sealed in a package 3 consisting of a recessed base 1 and a cover 2, the crystal chip 4 and the IC chip 5 are independently fixed either to the bottom face of the recessed base 1 or to the inner surface of the cover 2. Then the open end face of the recessed base 1 and the outer circumferential face of the cover 2, both having conductor patterns extending over the surface, are sealed by an anisotropic conductive adhesive.
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