SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor in which the glass base is not cracked when a metal pipe is jointed to the glass base. SOLUTION: A semiconductor pressure sensor chip having a thin diaphragm 1a formed by making a recess is bonded to a base 2 having a through hole 2a for introducing pressure to the diaphragm 1a and soldered with the metal pipe 4 of a package through a metalized layer 8 formed on the opposite side of the base 2 thus obtaining a semiconductor pressure sensor. The through hole 2a of the base 2 is applied, at he corner part of the opening on the metal pipe 4, with a thin film coating 11 of the same material as that of the base 2 from above the metalized layer 8 such that the coating 11 reaches a specified depth on the inner wall of the through hole 2a.