| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent junction break of a terminal such as of a bump even when no underfilling agent is provided of repair (part replacement). SOLUTION: The semiconductor device comprises a semiconductor chip 1, terminals 4 which are electrically connected to pads on the semiconductor chip 1, and reinforcements 6 which are formed on the surface where the terminals 4 are provided and whose size in a radial direction from the center of the surface is larger than that in a direction perpendicular to the radial direction (and diameter of the terminal 4). The terminals 4 and the reinforcements 6 can be directly formed on the semiconductor chip 1, or formed on one side (opposite to the side where the semiconductor chip 1 is mounted) of a package substrate 2 like a chip size package. |
