发明名称 HEAT TREATMENT APPARATUS AND METHOD FOR MEASURING TEMPERATURE OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To measure the temperature of the plural regions of a substrate, and to reduce cost by reducing the number of part items in a heat treatment apparatus. SOLUTION: In a heat treatment apparatus 1 for measuring the temperature of a substrate 9, and for heating the substrate 9, a reflector 123 facing opposite the substrate 9 is provided with a temperature-measuring mechanism 50 and plural second radiation thermometers rods 60. The temperature-measuring mechanism 50 can switch the effective reflectivity of a reflector 123 in the first radiation thermometer rod 55. The temperature and emissivity of the substrate 9 can be obtained, based on the output of the first radiation thermometer rod 55 before and after the switching of the effective radivity, and the temperature of the region of the substrate 9 which faces opposite each second radiation thermometer rod 60 can be obtained, based on the output of the obtained emissivity and the output of the second radiation thermometer rod 60. Thus, the temperature of the plural regions of the substrate 9 can be measured with a simple constitution, and costs can be reduced by reducing the number of part items of the heat treatment device 1.
申请公布号 JP2000133600(A) 申请公布日期 2000.05.12
申请号 JP19980305661 申请日期 1998.10.27
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 SASAKI KIYOHIRO;NOZAKI KIMIHIDE
分类号 H01L21/205;G01J5/00;H01L21/26;H01L21/31;(IPC1-7):H01L21/205 主分类号 H01L21/205
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