| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for measuring the thermal resistance of electronic components capable of measuring the thermal resistance of electronic components themselves such as ICs. SOLUTION: In a method for measuring the thermal resistance of an IC 1, a current load circuit which produces heat and consumes electric power with the passage of a current at the time of the impression of a voltage is internally provided. As changing the consumption of electric power in the current load circuit by connecting a voltage line 2 to the current load circuit and changing a predetermined voltage to be impressed by the voltage source 2, the temperature of a chip in the IC 1 is measured. Power consumption in the current load circuit at the time when the predetermined voltage is the first value is designated by W1, and a junction temperature at this time is designated by T1. Next, the predetermined voltage is raised to the second value different from the first value. The consumption of electric power at this time is designated by W2, and the junction temperature at this time is designated by T2. The value of the thermal resistance at this time is designated by (T2-T1)/(W2-W1).
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