| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which is capable of dissipating heat released from an electronic part out of a housing, enhanced in heat releasing capacity, and lessened in number of component parts and manufacturing cost, and can be easily and firmly joined to a heat releasing electronic part such as an MPU (micro processing unit) by so-called clip fastening. SOLUTION: This heat sink for electronic equipment is equipped with a heat dissipating plate 5 mounted on the one surface of a heat conductive metal plate 3 that serves as the one side wall of an electronic part housing case 2 and a clip (mounting member) 8 equipped with mounting hooks 9 and 9 which are inserted into insertion holes 10 and 10 provided to the heat conductive metal plate 3, a U-shaped groove 13 where a part of the clip 8 is fitted and fastened is provided to the surface of the heat dissipating plate 5 that confronts the heat conductive metal plate 3, and heat dissipating fins 6 are provided to the other surface of the heat dissipating plate 5.
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