FORMATION MATERIAL FOR WIRING PATTERN TRANSFER, MANUFACTURE OF FORMATION MATERIAL FOR WIRING PATTERN TRANSFER, WIRING BOARD USING FORMATION MATERIAL FOR WIRING PATTERN TRANSFER AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring pattern formation material for transfer, which can transfer a microscopic wiring pattern easily and reliably. SOLUTION: A two-layer structure of a metal layer formed by laminating a first metal layer 102 and a second metal layer 101 via a bonding, agent layer 103 in this order of the layer 102 and the layer 103 on a support layer 104 is formed and the layer 101 is processed into a wiring pattern shape to form a wiring pattern formation material 1 for transfer. It is preferable that the bonding strength of the layer 102 to the layer 101 is weaker than the bonding strength of the layer 102 to the layer 104. For example, if the mean roughness (Ra) along the center line of the surface of the layer 102 is set in a roughness of 2μm or higher, the adhesion of the layer 102 to the layer 101 can be enhanced. Moreover, it is preferable that the layer 102 contains nickel and the layer 102 contains copper.