发明名称 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE PROVIDED THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of easy and sure marking, and a semiconductor device provided with the chip. SOLUTION: In a semiconductor chip 3, in which a circuit element and a plurality of terminal parts 31 connected electrically with the circuit element are formed on one surface 30 side, the other surface 32 facing the one surface 30 is made satin-finished or is covered with a resin layer. Moreover, a semiconductor device 1 is constituted by using the semiconductor chip 3.
申请公布号 JP2000133731(A) 申请公布日期 2000.05.12
申请号 JP19980306702 申请日期 1998.10.28
申请人 ROHM CO LTD 发明人 SHIBATA KAZUTAKA;UEDA SHIGEYUKI
分类号 H01L23/12;H01L21/02;H01L23/00;H01L23/28;(IPC1-7):H01L23/00 主分类号 H01L23/12
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