摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of easy and sure marking, and a semiconductor device provided with the chip. SOLUTION: In a semiconductor chip 3, in which a circuit element and a plurality of terminal parts 31 connected electrically with the circuit element are formed on one surface 30 side, the other surface 32 facing the one surface 30 is made satin-finished or is covered with a resin layer. Moreover, a semiconductor device 1 is constituted by using the semiconductor chip 3. |