| 摘要 |
PROBLEM TO BE SOLVED: To improve the frequency characteristic of the input/output terminal portion of an enclosure by converting the transmission mode of a signal from a planar transmission-line mode into another transmission mode just before the package-wall portion of a feed-through portion of a high-frequency package, and by reconverting the transmission mode of the signal into the planar transmission-line mode after passing the signal through the package-wall portion. SOLUTION: In a feed-through portion 1 of a high-frequency package, a dielectric mounting type waveguide is provided just below a microstrip line 1a, to couple in an electromagnetic-field way the microstrip line 1a to the waveguide via a slit 1g. In this way, a signal is transmitted by the microstrip line 1a, and the transmission mode of the signal is converted into a dielectric mounting waveguide mode which is coupled thereto via the slit 1g just before the package-wall portion of the feed-through portion 1 to transmit the signal in the waveguide mode when it is passed through the package-wall portion. Furthermore, after passing the signal through the package-wall portion, the waveguide mode is reconverted into the mode of the microstrip line 1a via the slit 1g. |
