| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer wiring board, which raises the adhesion of a photosensitive insulating film to a plated layer constituting a wiring pattern and raises the reliability of the wiring pattern. SOLUTION: In the manufacture of multilayer wiring board of a structure, wherein insulating layers 16 and wirings are alternately laminated on an insulating board 11 having at least more than one of through hole parts, which are not perforated, a first process for providing previously the through hole parts in the board 11 having conductive layers 12, a second process for performing a desmear treatment and applying an electroless plating and an electolytic plating 14, a third process, wherein a dry film 15 is laminated on the board 11, a pattern exposure, a developing treatment, an etching, a treatment of a resist and the peeling of the resist are performed and a perforation of the parts 13 is performed, subsequently, a fourth process, wherein the photosensitive insulating films 16 are developed on the board 11, the parts 13 and a via hole part are perforated by a photolithography and an electroless plating treatment and an electrolytic plating 17 treatment are performed, and moreover, a fifth process for forming a wiring pattern are continuously performed. |
