发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive composition superior in pattern forming performance by applying a specified composition in specified conditions and exposing it in specified conditions and developing it with an aqueous solution of specified % tetramethylammonium hydroxide for specified seconds, and at that time, controling film thickness decrease to specified value or less. SOLUTION: The photosensitive composition composed essentially of a polybenzoxazole precursor represented by formula I is applied so as to control a film thickness to 10&plusmn;1 &mu;m after prebaking it for 4 min at 120 deg.C, and exposed, after prebaking, in conditions 300 mj/cm2, and developed with an aqueous solution of 2.38% tetramethylammonium hydroxide for 80 sec, and at that time, no film remains in exposed parts and decrease of film thickness in unexposed parts is <=2 &mu;m. In the formula, X is a tetravalent cyclic group; Y is a divalent group; Z is a group of formula II; each of R1 and R2 is a divalent organic group; each of R3 and R4 is a monovalent organic group; E is an aliphatic group having an alkenyl group or the like; (a) is 60.0-100.0 mol%; (b) is 0-40 mol%; and (n) is 2-500.
申请公布号 JP2000131840(A) 申请公布日期 2000.05.12
申请号 JP19980300465 申请日期 1998.10.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 MIYAO KENJI;BANBA TOSHIO;HIRANO TAKASHI
分类号 H01L21/027;C08G73/12;C08L79/04;C08L83/10;G03F7/022;G03F7/037;G03F7/038;G03F7/075;G03F7/30;G03F7/38;G03F7/40 主分类号 H01L21/027
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