发明名称 MANUFACTURE OF THIN FILM ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film element in which the generation of any damage can be suppressed by allowing stable etching to progress even at the time of forming the thin film element by using reactive ion etching on an insulating substrate. SOLUTION: At the time of forming a thin film element by a method for manufacturing the thin film comprising at least a process for forming a conductive film on an insulating substrate 1 and a process for carrying out working by using reactive ion etching, the reactive ion etching is operated in a state that any conductive film is not present at the side peripheral part or peripheral edge part of a substrate edge part 11A (or the presence of any conductive film is suppressed).</p>
申请公布号 JP2000133637(A) 申请公布日期 2000.05.12
申请号 JP19980307466 申请日期 1998.10.28
申请人 SONY CORP 发明人 SATO TAKUO;TAKATOKU MASATO;WAKITA YUKI;OTA KOJI
分类号 H01L21/302;G02F1/136;G02F1/1368;H01L21/3065;H01L21/336;H01L29/786;(IPC1-7):H01L21/306 主分类号 H01L21/302
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