| 摘要 |
<p>The invention concerns a method which consists in stacking (3) semiconductor chips each containing at least an integrated circuit and comprising connecting pads for interconnecting the chips. The outer surface of the chips is metal-coated (4) to produce a ground plane for the receiver antenna. The ground plane (5) is covered with a dielectric material whereof the surface not shared with the ground plane is metal-coated then etched (6) to form the receiver antenna. The invention is applicable to receivers incorporated in ammunitions.</p> |
