发明名称 ELECTRONICS ASSEMBLY APPARATUS WITH IMPROVED IMAGING SYSTEM
摘要 A pick and place machine (50), and its imaging system (84, 106, 278) are provided. The imaging system is movable with a head (87) of the pick and place machine (50) and includes a linear detector (150) which is adapted to move proximate the component (96) to thereby scan the component (96). The imaging system (84, 106, 278) provides a video output (718) that is used to calculate an orienation of the component (96) and to adjust the orientation for suitable mounting upon a workpiece such as a printed circuit board. The imaging system (84, 106, 278) is also useful in additional electronics assembly devices such as screen printers (350) and wire bonders (340). Methods of mounting a component (96) to a workpiece are also provided. Generally, a linear detector (150) with imaging optics (156) is passed proximate the component (96) to image the component (96). Component orientation is then computed and corrected such that the component (96) can be suitably mounted upon the work piece.
申请公布号 WO0026640(A1) 申请公布日期 2000.05.11
申请号 WO1999US26186 申请日期 1999.11.04
申请人 CYBEROPTICS CORPORATION 发明人 CASE, STEVEN, K.;SKUNES, TIMOTHY, A.;KONICEK, JOHN, P.
分类号 G01B11/00;G01B11/02;G01N21/956;G06T1/00;H01L21/60;H04N7/18;H05K13/04;H05K13/08 主分类号 G01B11/00
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