| 摘要 |
<p>A wafer support device (14) characterized by comprising a wafer support body (22) having on the front surface thereof a wafer (W) supporting area (26) and a plurality of lift pieces (36) each extending from the outer side of the wafer supporting area of the wafer support body to the inner side of the area, having on the front surface thereof an inclined surface inclined toward a lower inner side and capable of moving vertically between a position below the front surface of the wafer support body and a position above the front surface.</p> |
