| 摘要 |
A compact defect detection system is provided that comprises an optical pickup and a controller. As a surface of a semiconductor wafer is scanned by the defect detection system, the optical pickup generates a detector current signal that varies with the presence and the absence of defects on the surface of the semiconductor wafer. The controller monitors and interprets the generated detector current signal to affect defect detection. Because the wafer is scanned at a known rate, the size and the location of defects can be determined. Preferably defect-free wafers are scanned through the defect detection system to generate reference signals that may be used for comparison purposes with subsequently scanned production wafers. An array of optical pickups or a deflector may be employed to increase the portion of the semiconductor wafer scanned during defect detection.
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