Polierteil und Wafer-Poliervorrichtung

摘要

A polishing apparatus is provided which can effect surface-based polishing of a wafer without causing the wafer to produce an undulation or peripheral protrusion. A sheetlike polishing member 5 constructedby superposing a foam sheet 2 containing minute closed cells in a web of chloroprene rubber and a velour type non-woven fabric (polishing cloth 3) is attached fast to the surface of a polishing table 1. The polishing member is capable of polishing a given wafer while maintaining the uniformity of thickness of the wafer or an oxide film formed on the surface of the wafer because, during the application of pressure by a pressing member 14, the polishing pressure is uniformly distributed throughout the entire rear surface of the wafer and the polishing member is bent in conformity with the global rises and falls in the wafer surface.