发明名称 Optisches Modul und Verfahren zu seiner Herstellung
摘要 An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector. An optical module comprises the sub-module and a molded receptacle having a first fitting portion into which the at least one optical connector is inserted so that the first fitting portion is fitted to the molding resin member, and a second fitting portion to which an optical plug holding the end of the optical fiber to be inserted in the optical connector, is fitted, the second fitting portion being communicated with the first fitting portion. The optical sub-module is formed through transfer molding. <IMAGE>
申请公布号 DE69033400(T2) 申请公布日期 2000.05.11
申请号 DE1990633400T 申请日期 1990.09.26
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 GO, HISAO;MATSUMURA, YUTAKA
分类号 B29C70/72;G02B6/38;G02B6/42 主分类号 B29C70/72
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