发明名称 METHOD OF THREE-DIMENSIONAL WIRE ALIGNMENT AND AN APPARATUS THEREFOR AND METHOD OF MANUFACTURING AN ELECTRICALLY CONDUCTIVE MATERIAL
摘要 A method and device (10) for three-dimensional arrangement of wire for manufacturing a wire structural body in which a wire (13) is arranged threedimensionally at a specified pitch, wherein, after one or more architrave-like frame bodies (12) with a specified thickness in circumferential direction of a rotating shaft (11) are arranged, the rotating shaft (11) is rotated so as to wind the wire (13) around the architrave-like frame bodies (12) at a specified pitch so that the wire (13) surrounds the rotating shaft (11) and architravelike frame bodies (12), new architrave-like frame bodies (12) are stacked on the architrave-like frame bodies (12), and the operation to wind the wire (13) around these frame bodies at a specified pitch is repeated, whereby a wire structural body in which the wire is accurately arranged three-dimensionally at a specified pitch can be manufactured.
申请公布号 CA2317717(A1) 申请公布日期 2000.05.11
申请号 CA19992317717 申请日期 1999.10.15
申请人 NGK INSULATORS, LTD. 发明人 TANAKA, RITSU;SUZUKI, TOMIO
分类号 H01R13/24;H01R43/00;(IPC1-7):B21F45/00 主分类号 H01R13/24
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