Ball grid array measuring device for integrated circuit (IC) component uses spring biased test pins contained in angled bores in measuring device housing mounted on circuit board

摘要

Measuring device (160) has a housing (162) mounted on a circuit board (164) and provided with a number of angled bores ((166) receiving respective test pins (168) which are elastically biased into electrical contact with corresponding test points (170) of the tested IC component (172), e.g. via associated springs, or an elastomer diaphragm.