发明名称 |
DEVICE AND METHOD FOR PRODUCING A CHIP-SUBSTRATE CONNECTION |
摘要 |
<p>An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device has a radiation source in the form of a laser in the infrared wavelength range. The support is formed by a heat body, which is assigned to the chip-substrate connection and is heated with thermal radiation by the radiation source. A surface of the heat body is coated with a material, in particular a material containing chromium, exhibiting high absorption with respect to the light radiation emitted by the radiation source.</p> |
申请公布号 |
EP0998756(A1) |
申请公布日期 |
2000.05.10 |
申请号 |
EP19980947310 |
申请日期 |
1998.07.20 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GROETSCH, STEFAN;ALTHAUS, HANS-LUDWIG;SPAETH, WERNER;BOGNER, GEORG |
分类号 |
H01L21/52;H01L21/60;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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