发明名称 |
Improvements in or relating to integrated circuit device packages |
摘要 |
An integrated circuit device package is (!) provided which incorporates one or more differential pairs (20) of signal lines coupled to an integrated circuit device. The differential pairs each include a first signal line (21) and a second signal line (22). The first signal lines are non-coplanar with the second signal lines. The first signal lines of the differential pairs may be provided in a first plane. The second signal lines of the differential pairs may be provided in a second plane different from the first plane. A first ground plane (51) is provided adjacent the first signal lines and a second ground plane (52) is provided adjacent the second signal lines. The spacing of respective signal lines provides, among other things, the capability of having a greater density of differential pairs of signal lines within the planar area of an integrated circuit device package. <IMAGE> |
申请公布号 |
EP0849793(A3) |
申请公布日期 |
2000.05.10 |
申请号 |
EP19970122427 |
申请日期 |
1997.12.18 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
LAMSON, MICHAEL A. |
分类号 |
H01L23/12;H01L23/498;H01L23/66 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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