发明名称 |
Method of forming via holes in an insulation film and method of cutting the insulation film |
摘要 |
A method of forming via holes (6) in an organic insulation film (1) or cutting the film (1) comprises the steps of exposing predetermined parts of the film (1) to a laser beam to raise a temperature of the exposed parts of the film (1) until the exposed parts are transformed or decomposed and subjecting the film (1) to an ultra sonic wave (5) so that the transformed or decomposed parts are dispersed. <IMAGE> |
申请公布号 |
EP0661734(B1) |
申请公布日期 |
2000.05.10 |
申请号 |
EP19940120674 |
申请日期 |
1994.12.27 |
申请人 |
NEC CORPORATION |
发明人 |
BELGACEM, HABA;MORISHIGE, YUKIO |
分类号 |
B23K26/16;B23K26/38;B23K26/40;H01L21/48;H05K3/00;H05K3/38 |
主分类号 |
B23K26/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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