| 摘要 |
PROBLEM TO BE SOLVED: To satisfy the requirements of miniaturization by bonding a substrate to a wiring board arranged with pad for making electrical contact with the carriage side using an anisotropic conductive film composed of conductive particles and an insulating adhesive. SOLUTION: An anisotropic conductive film is applied, while stripping a peeling sheet from one side thereof, onto the electrodes 302 on a substrate 203 where an electrothermal converter is formed and then it is hot pressed while being aligned. Subsequently, the remaining peeling sheet is stripped and, at the forward end part of wiring board side electrodes 301 of an outside electrode film 305, the part corresponding to the electrodes 302 on the side of substrate for forming the electrothermal converter is superposed on the anisotropic conductive film before it is hot pressed from above a base film. Consequently, the thermosetting binder of the anisotropic conductive film is cured and mixed metallic particles are collapsed by being clamped between the wiring board side electrodes 301 and the electrodes 302 on the side of substrate for forming the electrothermal converter. Consequently, an electrically conducting state is brought about and miniaturization is realized.
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