发明名称 Method of making an electronic package
摘要 An electronic package is made by electrically bonding groups of conductive leads to two circuitized members after aligning the leads with electrical conductors on the circuitized members. Retention members may be used to hold the leads in alignment relative to each other prior to bonding and then are removed. Removal may include tearing away the retention member in propinquity to notches in the leads.
申请公布号 US6060341(A) 申请公布日期 2000.05.09
申请号 US19980005538 申请日期 1998.01.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ALCOE, DAVID JAMES;ANDROS, FRANK EDWARD
分类号 H01L21/60;H01L23/495;H01L23/498;(IPC1-7):H01L21/44 主分类号 H01L21/60
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