METHOD FOR BORING GLASS SUBSTRATE AND GLASS DRILLING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a hole of a glass substrate which does not require processing by a tool, hardly generates particles and dispenses with a shorter processing time. SOLUTION: A glass substrate 2 is irradiated with a laser beam along a hole shape 1 and is heated to a temperature close to its softening temperature. The glass substrate is cooled right after the heating and a crack surface 3 along the hole shape is internally formed. The rear surface of the glass substrate 2 is heated by a heating means 10. While a hole plate part 4 is cooled from the front surface, the hole plate part is sucked and held. The hole plate part 4 shrinks and the portions exclusive of the hole plate part 4 of the glass substrate 2 expand. The crack surface 3 breaks and the hole plate part 4 is taken out of the hole.