| 发明名称 |
Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon |
| 摘要 |
A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
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| 申请公布号 |
US6061248(A) |
申请公布日期 |
2000.05.09 |
| 申请号 |
US19970897085 |
申请日期 |
1997.07.18 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OTANI, HIROYUKI;YAGI, YOSHIHIKO;YAMAMOTO, KENICHI |
| 分类号 |
H05K3/34;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/498;H05K1/18;(IPC1-7):H05K7/02 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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