发明名称 |
Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method |
摘要 |
The first pipe 34 delivers the first solution 21 containing polishing particles. The second pipe 37, containing a liquid mass flow unit 36, delivers the second solution containing a chemical substance. The outlet port of the first pipe and the outlet port of the second pipe are connected to one end portion of the third pipe 31. The third pipe has the other end portion with an inner diameter almost equal to the inner diameter of its one end portion. The first and second solutions introduced into the third pipe are mixed in the third pipe to generate a polishing liquid. The generated polishing liquid is supplied from the other end portion of the third pipe onto a polishing pad 13 to polish a semiconductor wafer 16.
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申请公布号 |
US6059920(A) |
申请公布日期 |
2000.05.09 |
申请号 |
US19970801857 |
申请日期 |
1997.02.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;EBARA CORPORATION |
发明人 |
NOJO, HARUKI;NAKATA, REMPEI;KAWASHIMA, KIYOTAKA |
分类号 |
B24B37/04;B24B57/02;H01L21/306;(IPC1-7):C23F1/02;B24B57/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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