| 摘要 |
PROBLEM TO BE SOLVED: To perform micro working for wafer by using photoresist materials by subsequently exposing wafer on which the photoresist materials are laminated to an energy source, developing the photoresist materials and performing dry etching for the laminated wafer. SOLUTION: Wafer is effectively washed and subsequently a laminating processing is performed for wafer by using a normal laminating technique. Subsequently, the laminated body is exposed to an energy source and a bridging action is performed after this exposition and before development. After the laminating processing, wafer is developed, an etching processing is received and photoresist is peeled. By using dry film photoresist, etching processings can be performed for the surface of wafer two times or more numbers of times before the next process. In each etching process, different depths can be made or large different etching area can be made. |
