| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sheet-like adhesive composition which can be used to prepare an electronic component device which is repairable and therefore need not be disposed of even when it is suffered from a failure in connection between its electrodes due to e.g. slide during the step of connection by mixing a polyhydroxypolyether resin with a synthetic rubber, an epoxy resin, and a curing agent. SOLUTION: This composition is prepared by mixing 15-45 wt.% polyhydroxypolyether resin having a number-average molecular weight of 2,000-50,000, a weight-average molecular weight of 6,000-200,000, and a glass transition temperature of 110-160 deg.C with 5-30 wt.% synthetic rubber having a number-average molecular weight of 100,000-300,000, an epoxy resin, a curing agent in such an amount as to give 0.8-1.2 equivalents of the hydroxyl groups per equivalent of the epoxy groups of the epoxy resin, and 10-70 wt.% silica particles having a means particle diameter 0.1-1.0μm and a maximum particle diameter of 5.0μm or below in such amounts that the total of the epoxy resin and the curing agent is 25-80 wt.%. The composition is dissolved in an organic solvent, and the solution is applied to a substrate to obtain a sheet-like adhesive composition having a thickness of 10-200μm.
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